Ensure the functionality and reliability of your electronic components and printed circuit board (PCB) assemblies with ºÚÁϲ»´òìÈ’s wide range of testing and advisory services.

ºÚÁϲ»´òìÈ’s state-of-the-art testing laboratories are equipped with the latest technology and staffed by industry experts, enabling us to validate components, determine proper functionality, and perform failure analysis. Our staff have broad expertise in PCB assembly testing methods and provide the insight you need to bring superior electronic components to market.

From the early chip design stage to volume production, we offer a wide range of test scopes. Our extensive knowledge base is at your disposal, providing invaluable assistance in designing, developing, testing, analyzing, and debugging even the most challenging projects.

Identifying counterfeit components

Counterfeit components often come disguised or with altered markings that make them hard to detect, but our third-party testing helps to protect your supply chain from counterfeits. Utilizing our expertise and the testing techniques mentioned below, we can inspect, detect, and identify counterfeit components accurately. We rely on a variety of indicators, including black-top detection, country of origin, electrical characterization, indents, logo and marking imperfections, packaging discrepancies, marking permanency, solderability, and texture variance. We are committed to protecting your supply chain and helping you mitigate the risks associated with counterfeit components.

The ºÚÁϲ»´òìÈ advantage

Trust ºÚÁϲ»´òìÈ to provide you with the highest level of service and expertise in ensuring the authenticity and quality of your electronic components. Our experience with electronic components for consumer goods is unmatched, and we can provide a wide array of testing services under one roof. If you’d like to learn more about PCB assembly testing or any of our other consumer electronics services, contact us today.

  • Ball Shear
  • Cross-section (Microsection) Analysis
  • Curve trace / Electrical Characterization
  • Decapsulation (De-Cap) – Jet-etch and acid
  • Differential Scanning Calorimetry (DSC)
  • Die Shear
  • Dynamic Mechanical Analysis (DMA)
  • Fourier Transform Interferometry (FTIR)
  • Materials Characterization: DSC, TMA, DMA, TGA, and Thermal Conductivity testing
  • Mechanical testing: tensile, shear, compression, and deflection
  • Optical Inspection and external package analysis
  • Scanning Acoustic Microscopy (CSAM)
  • Scanning Electron Microscopy (SEM/EDS)
  • Solderability
  • Thermal Conductivity
  • Thermal Gravimetric Analysis (TGA)
  • Thermal Mechanical Analysis (TMA)
  • Wire bond pull testing
  • X-Ray (Live-time, non-destructive inspection of the package)
  • X-Ray Fluorescence (XRF)
  • Counterfeit Component Inspection

Our team of over 9,000 Engaged Experts in North America, Europe, The Middle East, Australia, Asia and Africa are ready to help you.